Thermal Package Impedance

Purpose

Model thermal coupling in a semiconductor package

Library

Thermal / Components

Description

../../_images/thermalpackageimpedance.svg

The Thermal Package Impedance is used in conjunction with a Thermal Package Description to model the thermal coupling between multiple semiconductor devices and the case of a semiconductor module.

For additional information see section Thermal Package Description.

Parameters

Number of terminals: This parameter allows you to change the number of external thermal connectors of the component.
Package impedance: This parameter defines the state-space model of the thermal network between the individual semiconductor devices and the case of a module.
Initial temperature: The initial temperature difference between the internal states of the impedance and the thermal reference at simulation start, in degrees Celsius \((^\circ\mathrm{C})\). If left blank or if the value is nan, PLECS will initialize the value based on a thermal “DC” analysis, see Temperature Initialization.